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论文导读|Analysis and Design of a 1200 V All-SiC Planar……

中国电源学会 中国电源学会 2022-05-31

Published in

Volume: 2, Issue: 4, 2017 

Analysis and Design of a 1200 V All-SiC Planar Interconnection Power Module for Next Generation More Electrical Aircraft Power Electronic Building Blocks


Abstract

Compact, light weight and efficient Power Electronic Building Blocks are seen as fundamental components of future More Electric Power Systems, e.g. More Electrical Aircraft. Core elements supporting the trend are power modules employing solely SiC MOSFETs. In order to take advantage of the high switching speed enabled by SiC, novel modules concepts must be investigated. For example, low inductance planar interconnection technologies, integrated buffer capacitors and damping networks are possible solutions to mitigate switching overvoltages and oscillations at the switching node occurring for conventional modules. In this paper, the analysis and the design of a novel ultra-low inductance 1200 V SiC power module featuring an integrated buffer-damping network are discussed. The power module is first described and characterized with impedance measurements. Afterwards, a general optimization procedure for the sizing and the selection of the integrated components is presented and measurements are performed to verify the analysis and to highlight the improvements of the proposed solution.


Authors

Mattia Guacci

Power Electronic Systems Laboratory, ETH Zurich,Switzerland

Dominik Bortis

Power Electronic Systems Laboratory, ETH Zurich,Switzerland

Ivana F. Kovačević-Badstübner

Advanced Power Semiconductors Laboratory, ETH Zurich,Switzerland

Ulrike Grossner

Advanced Power Semiconductors Laboratory, ETH Zurich,Switzerland

Johann W. Kolar

Power Electronic Systems Laboratory, ETH Zurich,Switzerland


Keywords

All-SiC Power Module, Damping Network, Integrated Buffer Capacitor, Planar Interconnection Technology.


About CPSS TPEA

CPSS Transactions on Power Electronics and Applications (CPSS TPEA) is sponsored and published by China Power Supply Society and technically co-sponsored by IEEE Power Electronics Society. It publishes original and high quality peer reviewed papers in the field of power electronics and its applications. With the goal of promoting the technology of power electronics including concepts, theory, modeling and control, analysis and simulation, emerging technology and applications, CPSS TPEA is expected to be a favorable platform to strengthen information exchange in this area. Interested authors are welcome to submit your papers via the Manuscript Central (https://mc03.manuscriptcentral.com/tpea-cpss) online submission system. You can find more information on our website:

http://tpea.cpss.org.cn.


Why publish in CPSS TPEA

High level Editorial board will ensure the Transaction publishes only best and most insightful research.

Worldwide readership included by IEEE Xplore Digital Library (Open Access), EI Compendex and powerfully promoted by CPSS and IEEE PELS, allows your research to be easily accessed.

Open access fund set up by CPSS, help you disseminate your research to a widerly audience freely.

Prompt and rigorous peer review within 45 days from the date of manuscript submission, provides you with a quick decision about publication.

Easy online submission and tracking via Scholar One Manuscripts Center you can get the latest progress of your paper.


Call for papers


Special Issue on Robust and Reliable Power Electronics

Deadline for Submission of Manuscripts: May 15

Guest Editor-in-Chief

Frede Blaabjerg, Aalborg University, Denmark

Guest Co-Editor-in-Chief

Ke Ma, Shanghai Jiao Tong University, China


Special Issue on Vehicle Electrification

Deadline for Submission of Manuscripts: August 1

Guest Editor-in-Chief

Chris Mi, San Diego State University, USA

Guest Co-Editor-in-Chief

HJ Chiu, National Taiwan University of Science and Technology, Taiwan, China

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